DAISO GEL C4-P系列硅胶填料 daiso005

DAISO GEL C4-P系列 •适于生物分子的分离 •4种孔径可供选择 •快速分离大量疏水性物质 DAISO GEL C4-P填料是以硅胶为基材，键合丁基的中等疏水性填料。可提供6, 12, 20 and 30nm 四种孔径用于优化分离各种分子量的物质。12, 20和30nm的填料适于分离肽段和蛋白。低表面积和大孔硅胶可以有效地避免蛋白发生变性。除此之外，该种填料还可以快速分离大量的疏水性物质。 Product names and properties / analytical grades (minimum lot: 50g) Pore Size (nm) Particle Size (um) Pore Volume (mL/g) Surface Area (m2/g) Carbon (%) SP-60-3-C4-P 6 3 0.75 450 10 SP-60-5-C4-P 6 5 0.75 450 10 SP-120-3-C4-P 12 3 1 300 7 SP-120-5-C4-P 12 5 1 300 7 SP-200-3-C4-P 20 3 1.1 200 5 SP-200-5-C4-P 20 5 1.1 200 5 SP-300-3-C4-P 30 3 0.9 100 3 SP-300-5-C4-P 30 5 0.9 100 3 Product names and properties / preparative grades (minimum lot: 500g) Pore Size (nm) Particle Size (um) Pore Volume (mL/g) Surface Area (m2/g) Carbon (%) SP-60-10-C4-P 6 10 0.75 450 10 SP-60-15-C4-P 6 15 0.75 450 10 SP-60-20-C4-P 6 20 0.75 450 10 SP-60-40/60-C4 6 50 0.75 450 10 SP-120-10-C4-P 12 10 1 300 7 SP-120-15-C4-P 12 15 1 300 7 SP-120-20-C4-P 12 20 1 300 7 SP-120-40/60-C4 12 50 1 300 7 SP-200-10-C4-P 20 10 1.1 200 5 SP-200-15-C4-P 20 15 1.1 200 5 SP-200-20-C4-P 20 20 1.1 200 5 SP-200-40/60-C4 20 50 1.1 200 5 SP-300-10-C4-P 30 10 0.9 100 3 SP-300-15-C4-P 30 15 0.9 100 3 SP-300-20-C4-P 30 20 0.9 100 3 SP-300-40/60-C4 30 50 0.9 100 3