STANNOL锡膏 SP2500

STANNOL无铅锡膏的印刷适性对焊接结果的积极影响。

独特的润湿配方，满足了每一系列生产过程中表面润湿的要求。

STANNOL无铅锡膏回流焊后的少量残留物是轻的、透明的、电安全的，不需要除去。

残留物少，电气安全性好。稳定的印刷特性

The solder paste SP2500 has been developed for the high volume, lead-free SMD electronics manufacturing. The solder paste is characterized by less voiding. The long open times and the high printability have a positive effect on the soldering result. With a special formula for excellent wetting, it meets the requirements for wetting on the surfaces which can be found today in every series manufacturing process.

The low amounts of residues after the reflow are light, transparent, electrically safe and do not have to be removed.

PRODUCT ADVANTAGES
Less voiding
Reflow under air and nitrogen atmosphere possible
Long open times of the paste
No-Clean
Less residues, good electrical safety
Stable printing characteristics