STANNOL焊锡球 SP2500-04

☆由原材料开始熔解制造，并可依客户需求而研发生产。
☆自行研发之专利生产设备，可制造0.035mm~0.889mm高品质的BGA焊锡球，可适用于半导体及封装相关产业生产所需。
☆包装采用抗静电材质，可避免因静电而连着在瓶身，造成使用上之困扰。
☆<0.2mm的超小球采用真空铝箔包装。

☆均取得原厂专利授权，可安心使用，无侵权疑虑。

I started by raw materials and melting manufacturing, R & D and production according to customer needs and.
I developed the patented production equipment, BGA solder ball can produce high-quality 0.035mm~0.889mm, applicable to the semiconductor and packaging related industry required.
It adopts antistatic packaging material, can be avoided due to electrostatic and even in the bottle, the use of trouble.
<0.2mm, super ball vacuum aluminum foil packaging.
I have authorized the original patent infringement, can feel at ease to use, no doubt.