Wetting Balance 5200T

Wetting Balance

的详细介绍

This checker demonstrates its full capability for improving and controlling the soldering process of materials placed under microsoldering with highprecision, handy and secure operations coping with the present-day techniques of using chips everywhere as well as SMT soldering process.

适用标准
IEC 60068-2-54(Solderability testing by the wetting balance method)
JIS C 0050 (检查solderability 方法)
JIS C 0053 (检查(平衡的方法) solderability 方法)
JIS C 0054 (SMD) solderability
MIL-STD-202 方法208 (Solderability)
MIL-STD-883 方法2003 年(Solderability)
MIL-STD-883 方法2022 年(wetting 平衡Solderability)
EIAJ ET-7401 (solderability 方法)

J-STD-002

J-STD-003

IPC-TM-650

IPC-S-805A

JIS Z3198

ISO/FIDS 9455

DIN等

GB/T 20422-2006 (无铅焊料Lead-free solders)